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IEC/TS 62647-22 Ed. 1.0 en:2013

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
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IEC/TS 62647-22 Ed. 1.0 en:2013

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines

PUBLISH DATE 2013
IEC/TS 62647-22 Ed. 1.0 en:2013

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines

IEC/TS 62647-22:2013(E) is intended for use as technical guidance by aerospace, defence, and high performance (ADHP) electronic applications and systems suppliers, e.g., original equipment manufacturers (OEMs) and system maintenance facilities, in developing and implementing designs and processes to ensure the continued performance, quality, reliability, safety, airworthiness, configuration control, affordability, maintainability, and supportability of high performance aerospace systems both during and after the transition to Pb-free electronics.

The guidelines may be used by the OEMs and maintenance facilities to implement the methodologies they use to ensure the performance, reliability, airworthiness, safety, and certifiability of their products, in accordance with IEC/TS 62647-1:2012.

This document also contains lessons learned from previous experience with Pb-free aerospace electronic systems.

SDO IEC: International Electrotechnical Commission
Document Number IEC/TS 62647
Publication Date Oct. 7, 2013
Language en - English
Page Count
Revision Level 1.0
Supercedes
Committee 107
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