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IEEE 1355-1995

IEEE Standard for Heterogeneous InterConnect (HIC), (Low-Cost, Low-Latency Scalable Serial Interconnect for Parallel System Construction)
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IEEE 1355-1995

IEEE Standard for Heterogeneous InterConnect (HIC), (Low-Cost, Low-Latency Scalable Serial Interconnect for Parallel System Construction)

PUBLISH DATE 1996
PAGES 148
IEEE 1355-1995

New IEEE Standard - Inactive-Withdrawn.

Enabling the construction of high-performance, scalable, modular, parallel systems with low system integration cost is discussed.

Complementary use of physical connectors and cables, electrical properties, and logical protocols for point-to-point serial scalable interconnect, operating at speeds of 10-200 Mb/s and at 1 Gb/s in copper and optic technologies, is described.

Physical connectors and cables, electrical properties, and logical protocols for point to point serial scalable interconnect, operating at speeds of 10-200 Mbit/sec and at 1 Gbit/sec in copper and optic technologies.

As developed in Open Microprocessor systems Initiative/heterogeneous InterConnect Project (OMI/HIC).

To enable **high-performance, scaleable, modular, parallel systems** to be constructed with low system integration cost;

to support communications system fabric;

to provide a transparent implementation of a range of high level protocols (communications, e.g. _Asynchronous Transfer Mode (ATM)_, message passing, shared memory transactions e.g. _SCI, Futurebus+_, etc.);

to support links between heterogeneous systems.

SDO IEEE: Institute of Electrical and Electronics Engineers
Document Number 1355
Publication Date June 12, 1996
Language en - English
Page Count
Revision Level
Supercedes
Committee Microprocessor Standards Committee
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