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IEEE Standard for Heterogeneous InterConnect (HIC), (Low-Cost, Low-Latency Scalable Serial Interconnect for Parallel System Construction)
New IEEE Standard - Inactive-Withdrawn.
Enabling the construction of high-performance, scalable, modular, parallel systems with low system integration cost is discussed.
Complementary use of physical connectors and cables, electrical properties, and logical protocols for point-to-point serial scalable interconnect, operating at speeds of 10-200 Mb/s and at 1 Gb/s in copper and optic technologies, is described.
Physical connectors and cables, electrical properties, and logical protocols for point to point serial scalable interconnect, operating at speeds of 10-200 Mbit/sec and at 1 Gbit/sec in copper and optic technologies.
As developed in Open Microprocessor systems Initiative/heterogeneous InterConnect Project (OMI/HIC).
To enable **high-performance, scaleable, modular, parallel systems** to be constructed with low system integration cost;
to support communications system fabric;
to provide a transparent implementation of a range of high level protocols (communications, e.g. _Asynchronous Transfer Mode (ATM)_, message passing, shared memory transactions e.g. _SCI, Futurebus+_, etc.);
to support links between heterogeneous systems.
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