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ISO/IEC/IEEE International Standard - Information Technology - Microprocessor systems - Heterogeneous InterConnect (HIC) (Low-Cost, Low-Latency Scalable Serial Interconnect for Parallel System Construction)
New IEEE Standard - Inactive-Withdrawn.
Enabling the construction of high-performance, scalable, modular, parallel systems with low system integration cost is discussed.
Complementary use of physical connectors and cables, electrical properties, and logical protocols for point-to-point serial scalable interconnect, operating at speeds of 10-200 Mb/s and at 1 Gb/s in copper and optic technologies, is described.
The scope of this standard is the physical connectors and cables, electrical properties, and logical protocols for point-to-point serial scalable interconnect.
It covers operating speeds of 10-200 Mb/s and at 1 Gb/s in copper and optic technologies [as developed in Open Microprocessor Systems Initiative/Heterogeneous InterConnect Project (OMI/HIC)].
The purpose of this standard is to enable high performance, scalable, modular, parallel systems to be constructed with low system integration cost.
It aims to support communications systems fabric and to provide a transparent implementation of a range of high level protocols [communications (e.g., ATM), message passing, shared memory transactions, etc.].
Additionally, it supports links between heterogeneous systems.
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