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IPC-1602A

Standard for Printed Board Handling and Storage
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The industry's sole standard on the handling, packaging and storage of printed boards. The requirements in this document are intended to protect printed boards from contamination, physical damage, solderability degradation, ESD and moisture uptake. Consideration is given to packaging material types and methods, production environment, handling and transport of product, and establishing baking profiles for moisture removal. This document addresses the impact of baking on printed board solderability, moisture concerns for etched cores and composites, dry packaging requirements including moisture barrier bags (MBBs), desiccant material and HIC cards, test coupons for evaluating relative moisture absorption and guidance for floor life and rework by baking. Supersedes IPC-1602.
SDO IPC: IPC by Global Electronics Association
Document Number 1602
Publication Date Nov. 1, 2024
Language en - English
Page Count 36
Revision Level
Supercedes
Committee
Publish Date Document Id Type View
Nov. 1, 2024 IPC-1602A Revision
April 1, 2020 IPC-1602 Revision
Not Available IPC-1602 Revision