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IPC-2614

Sectional Requirements for Board Fabrication Documentation
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IPC-2614

Sectional Requirements for Board Fabrication Documentation

PUBLISH DATE 2010
IPC-2614
Sectional Requirements for Board Fabrication Documentation
This standard establishes the requirements for the documentation of printed circuit board fabrication, and identifies the physical attributes and performance requirements of the unpopulated product. The descriptions apply to rigid, flexible, inorganic substrates or any combination thereof. The construction may be single, double, multilayered, or HDI technology and may include embedded (integrated) components. The requirements pertain to both hard copy and electronic data descriptions. 59 pages. Released March 2010.Included in C-102, C-105, C-106 and C-1000
SDO IPC: IPC by Global Electronics Association
Document Number 2614
Publication Date April 30, 2010
Language en - English
Page Count
Revision Level 0
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Publish Date Document Id Type View
April 30, 2010 IPC-2614 Revision