IPC-D-279

Current Revision
Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies

Best Price Guarantee Jul 1, 1996 English 146 Pages

Sub Total (1 Item(s)) $ 0.00
Estimated Shipping $ 0.00
Total (Pre-Tax) $ 0.00

You own the digital copy of this edition

View in Library
or
IPC by Global Electronics Association Logo

IPC-D-279

Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies

PUBLISH DATE 1996
IPC-D-279
Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies
Establishes design concepts, guidelines and procedures for reliable printed wiring assemblies. Focuses on SMT or mixed technology PWAs, specifically addressing the interconnect structure and the solder joint itself. Discusses substrates, components, attachment materials, coatings and assembly processes and testing considerations. In addition, this document contains detailed appendices covering: solder attachments; plated-through via structures; insulation resistance; thermal considerations; environmental stresses; coefficient of thermal expansion; electrostatic discharge; solvents; testability; corrosion aerospace and high altitude concerns. 137 pages. Released July 1996.
Loading...

Failed to load document history.

Publish Date Document Id Type View