Logo
Login Sign Up
Current Revision

IPC-D-279

Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies
Best Price Guarantee
Instant

$198.00


Sub Total (1 Item(s))

$ 0.00

Estimated Shipping

$ 0.00

Total (Pre-Tax)

$ 0.00


or
IPC by Global Electronics Association Logo

IPC-D-279

Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies

PUBLISH DATE 1996
IPC-D-279
Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies
Establishes design concepts, guidelines and procedures for reliable printed wiring assemblies. Focuses on SMT or mixed technology PWAs, specifically addressing the interconnect structure and the solder joint itself. Discusses substrates, components, attachment materials, coatings and assembly processes and testing considerations. In addition, this document contains detailed appendices covering: solder attachments; plated-through via structures; insulation resistance; thermal considerations; environmental stresses; coefficient of thermal expansion; electrostatic discharge; solvents; testability; corrosion aerospace and high altitude concerns. 137 pages. Released July 1996.
SDO IPC: IPC by Global Electronics Association
Document Number D279
Publication Date July 1, 1996
Language en - English
Page Count
Revision Level 0
Supercedes
Committee
Publish Date Document Id Type View
July 1, 1996 IPC-D-279 Revision