Logo
Login Sign Up
Current Revision

IPC-4203B

Cover and Bonding Material for Flexible Printed Circuitry
Best Price Guarantee
Instant

$161.00

2-5 Days

$188.00

SAVE 10%

$314.10


Sub Total (1 Item(s))

$ 0.00

Estimated Shipping

$ 0.00

Total (Pre-Tax)

$ 0.00


View in Library
or
IPC by Global Electronics Association Logo

IPC-4203B

Cover and Bonding Material for Flexible Printed Circuitry

PUBLISH DATE 2018
IPC-4203B
Cover and Bonding Material for Flexible Printed Circuitry
IPC-4203B establishes the classification system, the qualification and quality conformance requirements for dielectric films coated with an adhesive on one or both sides, which are to be used as cover material and/or bondply for flexible printed circuitry, as well as supported or unsupported adhesive films to be used in the fabrication of flexible printed circuitry. IPC-4203B does not cover non-flexible adhesives designed to be used in the rigid board areas of rigid flex constructions, which are covered in IPC-4101. Materials such as liquid-applied covercoat (see 3.1.8.3) are covered in IPC-SM-840 and are excluded from this document. 38 pages.
SDO IPC: IPC by Global Electronics Association
Document Number 4203
Publication Date March 1, 2018
Language en - English
Page Count 52
Revision Level B
Supercedes
Committee
Loading...

Failed to load document history.

Publish Date Document Id Type View