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IPC-4552B

Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards
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IPC-4552B

Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards

PUBLISH DATE 2021
IPC-4552B
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards
IPC-4552B standard sets the requirements for Electroless Nickel / Immersion Gold (ENIG) deposit thickness for applications including soldering, wire bonding, and as a contact finish. IPC-4552B standard is used to specify acceptance criteria to meet performance standards for IPC-6010 family of documents including IPC-6012, IPC-6013 and IPC-6018. The ENIG deposit specified using this document will meet the highest coating durability rating as specified in IPC-J-STD-003 printed board solderability specification.
SDO IPC: IPC by Global Electronics Association
Document Number 4552
Publication Date May 1, 2021
Language en - English
Page Count 156
Revision Level B
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