IPC-4555

Current Revision
Performance Specification for High Temperature Organic Solderability Preservatives (OSP) for Printed Boards

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IPC-4555

Performance Specification for High Temperature Organic Solderability Preservatives (OSP) for Printed Boards

PUBLISH DATE 2022
IPC-4555
Performance Specification for High Temperature Organic Solderability Preservatives (OSP) for Printed Boards
The IPC-4555 standard covers the requirements and testing for organic solderability preservatives (OSP) processes for printed boards to be used primarily for electrical and electronic circuits. Details for lead free soldering are covered in IPC-4555
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