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IPC-4761

Design Guide for Protection of Printed Board Via Structures
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IPC-4761

Design Guide for Protection of Printed Board Via Structures

PUBLISH DATE 2006
IPC-4761
Design Guide for Protection of Printed Board Via Structures
IPC-4761 is the sole industry guideline providing PCB designers, manufacturers and uses with detailed information on all existing methods for protecting vias on printed boards, including all types of via tenting, plugging, filling and capping. Production issues, long term reliability concerns and material specification and selection are provided to aid in evaluating the benefits and concerns for employing each type of via protection. 16 pages. Released July 2006.
SDO IPC: IPC by Global Electronics Association
Document Number 4761
Publication Date July 1, 2006
Language en - English
Page Count 28
Revision Level 0
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