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IPC-6012F

Space and Military Avionics Applications Addendum to IPC-6012F, Qualification and Performance Specification for Rigid Printed Boards
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IPC-6012F

Space and Military Avionics Applications Addendum to IPC-6012F, Qualification and Performance Specification for Rigid Printed Boards

PUBLISH DATE 2023
IPC-6012F
Qualification and Performance Specification for Rigid Printed Boards
IPC-6012F, covers qualification and performance of rigid printed boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as electrical, mechanical and environmental requirements. IPC-6012 revision F incorporates many new and expanded requirements in areas such as printed board cavities, copper wrap plating, “intermediate” target lands, solderability testing, dewetting, microsection evaluation, internal plated layers, dielectric spacing and reliability issues with microvia structures. IPC 6012F is used with IPC-6011 and supersedes IPC-6012E.
SDO IPC: IPC by Global Electronics Association
Document Number 6012
Publication Date Sept. 1, 2023
Language en - English
Page Count 80
Revision Level F
Supercedes
Committee
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