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IPC 7530B

Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes
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This document provides useful and practical information for developing thermal profiles to produce acceptable SnPb and Pb-free electronics assemblies using reflow, vapor phase, laser, selective and wave soldering equipment. The document also includes a troubleshooting guide for addressing common defects which can be attributed to profiling.
SDO IPC: IPC by Global Electronics Association
Document Number 7530
Publication Date Jan. 31, 2025
Language en - English
Page Count 52
Revision Level B
Supercedes
Committee
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