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IPC-7711 5.6.4

BGA/CSP Installation Using Wire Solder to Prefill Lands

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IPC-7711 5.6.4

BGA/CSP Installation Using Wire Solder to Prefill Lands

IPC-7711 5.6.4
BGA/CSP Installation Using Wire Solder to Prefill Lands
BGA/CSP Installation Using Wire Solder to Prefill Lands
SDO IPC: IPC by Global Electronics Association
Document Number IPC
Publication Date Not Available
Language en - English
Page Count 2
Revision Level
Supercedes
Committee
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