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IPC-9502

PWB Assembly Soldering Process Guideline for Electronic Components
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IPC-9502

PWB Assembly Soldering Process Guideline for Electronic Components

PUBLISH DATE 1999
IPC-9502
PWB Assembly Soldering Process Guideline for Electronic Components
This document describes the manufacturing solder process limits that components subjected to IPC-9501, IPC-9504 and IPC/JEDEC J-STD-020 would survive. It does not include optimum conditions for assembly, but provides guidelines to ensure components are not damaged. This document applies to both surface-mount (SM) and through-hole (TH) components that are wave soldered, reflowed or hand soldered. This document is intended to complement other industry documents. Note: This document does not address the increased temperature requirements of lead-free solders.
SDO IPC: IPC by Global Electronics Association
Document Number 9502
Publication Date April 1, 1999
Language en - English
Page Count
Revision Level 0
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Publish Date Document Id Type View
April 1, 1999 IPC-9502 Revision