IPC-9701B

Current Revision
Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments

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IPC-9701B

Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments

PUBLISH DATE 2022
IPC-9701B
Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments
The IPC-9701B standard establishes a thermal cycling test method to characterize the fatigue lifetimes of surface mount solder attachments of electronic assemblies. The surface mount devices may be solder-attached to rigid, flexible or rigid-flex printed boards. The characterization results can be used to predict the field lifetime of solder attachments for the use environments and conditions of electronic assemblies.
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