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IPC-CI-408

Design & Application Guidelines for the Use of Solderless Surface Mount Connectors
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IPC-CI-408

Design & Application Guidelines for the Use of Solderless Surface Mount Connectors

PUBLISH DATE 1994
IPC-CI-408
Design & Application Guidelines for the Use of Solderless Surface Mount Connectors
Provides information on design characteristics and the application of solderless surface mount connectors, including conductive adhesives to aid IC package and board interconnection. 34 pages. Released January 1994.
SDO IPC: IPC by Global Electronics Association
Document Number CI408
Publication Date Jan. 1, 1994
Language en - English
Page Count 43
Revision Level 0
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