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IPC-HM-860

Specification for Multilayer Hybrid Circuits
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IPC-HM-860

Specification for Multilayer Hybrid Circuits

PUBLISH DATE 1987
IPC-HM-860
Specification for Multilayer Hybrid Circuits
Covers the qualification and performance requirements of multilayer circuits used in hybrid packaging. These circuits consist of three or more layers of conductor patterns separated from each other by insulating materials and interconnected by a continuous metallic interlayer connection. The substrate may include passive elements. 66 pages. Released January 1987.
SDO IPC: IPC by Global Electronics Association
Document Number HM860
Publication Date Jan. 1, 1987
Language en - English
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Revision Level 0
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