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IPC-J-STD-003D

Solderability Tests for Printed Boards
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IPC-J-STD-003D

Solderability Tests for Printed Boards

PUBLISH DATE 2023
IPC-J-STD-003D
Solderability Tests for Printed Boards
The IPC J-STD-003D standard describes solderability determinations that are made to verify that the printed board fabrication processes and subsequent storage have had no adverse effect on the solderability of those portions of the printed board intended to be soldered. Solderability is determined by evaluation of a test specimen which has been processed as part of a panel of boards and subsequently removed for testing per the method selected. IPC J-STD-003D provides solderability test methods to determine the acceptance of printed board surface conductors, attachment lands, and plated-through holes to wet easily with solder, and to withstand the rigors of the printed board assembly processes.
SDO IPC: IPC by Global Electronics Association
Document Number J003
Publication Date Jan. 1, 2023
Language en - English
Page Count 44
Revision Level D
Supercedes
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