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IPC-J-STD-005B

Requirements for Solder Pastes
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Requirements for Solder Pastes
IPC J-STD-005B standard lists the requirements for qualification and characterization of solder paste. It references test methods, criteria, and metal content, viscosity, slump, solder ball, tack and wetting of solder pastes. Additional support is provided in IPC-HDBK-005, Guide to Solder Paste Assessment.
SDO IPC: IPC by Global Electronics Association
Document Number J005
Publication Date March 1, 2024
Language en - English
Page Count 24
Revision Level B
Supercedes
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