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IPC-J-STD-006C-AM1

Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
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IPC-J-STD-006C-AM1

Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications

PUBLISH DATE 2017
IPC-J-STD-006C-AM1
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications - AM1
The IPC-J-STD-006C-AM1 amendment provides better detail of a solder alloy's maximum allowed deviation about the nominal level of the element's mass than was provided in past alloy standards. The IPC-J-STD-006C-AM1 amendment provided information on negative effects of adding rare earth elements to specific, heavy tin-containing, lead-free solder alloys and propensity of tin whisker formation. Finally, the IPC-J-STD-006C-AM1 amendment inserted five new, patented lead-free solder alloys from 3 separate alloy suppliers for users of the IPC J-STD-006C standard.
SDO IPC: IPC by Global Electronics Association
Document Number J006
Publication Date Oct. 1, 2017
Language en - English
Page Count
Revision Level C
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