IPC/JEDEC-9704A

Current Revision
Printed Circuit Assembly Strain Gage Test Guideline

Best Price Guarantee Feb 3, 2012 32 Pages

Sub Total (1 Item(s)) $ 0.00
Estimated Shipping $ 0.00
Total (Pre-Tax) $ 0.00

You own the digital copy of this edition

View in Library
or
IPC by Global Electronics Association Logo

IPC/JEDEC-9704A

Printed Circuit Assembly Strain Gage Test Guideline

PUBLISH DATE 2012
IPC/JEDEC-9704A
Printed Circuit Assembly Strain Gage Test Guideline
Strain gage testing allows for objective analysis of the strain and strain rate levels to which a surface mount package may be subjected to during assembly, test and operation. Excessive strain can result in various failure modes for different solder alloys, package types, surface finishes or laminate materials. This document describes specific guidelines for strain gage testing during the printed board manufacturing process, including board assembly, test, system integration and other types of operations that may induce board flexure. This document also provides coverage of test setup and equipment requirements, strain measurement techniques and test report formats. Revision A contains 22 full-color photographs and illustrations depicting instrumented boards and gage placement and has been updated to address lead-free assembly technology. 25 pages. Released February 2012.Included in the C-103 and C-1000 Collections.
Loading...

Failed to load document history.

Publish Date Document Id Type View