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IPC-SM-784

Guidelines for Chip-on-Board Technology Implementation
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IPC-SM-784

Guidelines for Chip-on-Board Technology Implementation

PUBLISH DATE 1990
IPC-SM-784
Guidelines for Chip-on-Board Technology Implementation
Discusses chip types, board selection, design issues and thermal transfer methods for Chip on Board (COB) applications. Details wire bonding, TAB and flip chip designs and provides information on mounting materials, including adhesives, wires and various mechanical bonding techniques. 37 pages. Released November 1990.
SDO IPC: IPC by Global Electronics Association
Document Number SM784
Publication Date Nov. 1, 1990
Language en - English
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Revision Level 0
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Publish Date Document Id Type View
Nov. 1, 1990 IPC-SM-784 Revision