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IPC-T-50N

Terms and Definitions for Interconnecting and Packaging Electronic Circuits
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IPC-T-50N

Terms and Definitions for Interconnecting and Packaging Electronic Circuits

PUBLISH DATE 2021
IPC-T-50N
Terms and Definitions for Interconnecting and Packaging Electronic Circuits
IPC-T-50N document is designed to provide definitions for terms commonly used in the electronics industry. The definitions are intended to provide sufficient clarity of detail such that a reader utilizing English as a second language could understand the subtleties of the meaning. IPC-T-50N contains over 550 new or revised terms, including new terminology for via structures, surface mount device types, solder bumps, solder alloys, soldering, dewetting, board fabrication processes and testing
SDO IPC: IPC by Global Electronics Association
Document Number T50
Publication Date Nov. 1, 2021
Language en - English
Page Count
Revision Level N
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