IPC-T-50N

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Terms and Definitions for Interconnecting and Packaging Electronic Circuits

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IPC-T-50N

Terms and Definitions for Interconnecting and Packaging Electronic Circuits

PUBLISH DATE 2021
IPC-T-50N
Terms and Definitions for Interconnecting and Packaging Electronic Circuits
IPC-T-50N document is designed to provide definitions for terms commonly used in the electronics industry. The definitions are intended to provide sufficient clarity of detail such that a reader utilizing English as a second language could understand the subtleties of the meaning. IPC-T-50N contains over 550 new or revised terms, including new terminology for via structures, surface mount device types, solder bumps, solder alloys, soldering, dewetting, board fabrication processes and testing
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