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IPC-TM-650 2.3.24

Porosity Testing of Gold Electrodeposited on a Nickel Plated Copper Substrate Electrographic Method
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IPC-TM-650 2.3.24

Porosity Testing of Gold Electrodeposited on a Nickel Plated Copper Substrate Electrographic Method

IPC-TM-650 2.3.24
Porosity Testing of Gold Electrodeposited on a Nickel Plated Copper Substrate Electrographic Method
Porosity Testing of Gold Electrodeposited on a Nickel Plated Copper Substrate Electrographic Method
SDO IPC: IPC by Global Electronics Association
Document Number IPCTM
Publication Date Not Available
Language en - English
Page Count
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Supercedes
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