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IPC J-STD-027

Mechanical Outline Standard for Flip Chip and Chip Size Configurations
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IPC J-STD-027

Mechanical Outline Standard for Flip Chip and Chip Size Configurations

PUBLISH DATE 2003
IPC J-STD-027
Mechanical Outline Standard for Flip Chip and Chip Size Configurations
This standard establishes mechanical outline requirements for devices supplied in flip chip or Chip Size Package (CSP) formats, including die surface, die terminals, and interconnection balls/bumps/lands to the next level. 13 Pages. Released February 2003.
SDO IPC: IPC by Global Electronics Association
Document Number J027
Publication Date Feb. 1, 2003
Language en - English
Page Count
Revision Level 0
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Publish Date Document Id Type View
Feb. 1, 2003 J-STD-027 Revision