IPC J-STD-027

Current Revision
Mechanical Outline Standard for Flip Chip and Chip Size Configurations

Best Price Guarantee Feb 1, 2003 English 1 Pages

Sub Total (1 Item(s)) $ 0.00
Estimated Shipping $ 0.00
Total (Pre-Tax) $ 0.00

You own the digital copy of this edition

View in Library
or
IPC by Global Electronics Association Logo

IPC J-STD-027

Mechanical Outline Standard for Flip Chip and Chip Size Configurations

PUBLISH DATE 2003
IPC J-STD-027
Mechanical Outline Standard for Flip Chip and Chip Size Configurations
This standard establishes mechanical outline requirements for devices supplied in flip chip or Chip Size Package (CSP) formats, including die surface, die terminals, and interconnection balls/bumps/lands to the next level. 13 Pages. Released February 2003.
Loading...

Failed to load document history.

Publish Date Document Id Type View