Logo
Login Sign Up
Current Revision

IPC 9704A

Printed Circuit Assembly Strain Gage Test Guideline
Best Price Guarantee
Instant

$205.00

2-5 Days

$205.00

SAVE 10%

$369.00


Sub Total (1 Item(s))

$ 0.00

Estimated Shipping

$ 0.00

Total (Pre-Tax)

$ 0.00


View in Library
or
IPC by Global Electronics Association Logo

IPC 9704A

Printed Circuit Assembly Strain Gage Test Guideline

PUBLISH DATE 2012
IPC 9704A
Strain gage testing allows for objective analysis of the strain and strain rate levels to which a surface mount package may be subjected to during assembly, test and operation. Excessive strain can result in various failure modes for different solder alloys, package types, surface finishes or laminate materials. This document describes specific guidelines for strain gage testing during the printed board manufacturing process, including board assembly, test, system integration and other types of operations that may induce board flexure. This document also provides coverage of test setup and equipment requirements, strain measurement techniques and test report formats. Revision A contains 22 full-color photographs and illustrations depicting instrumented boards and gage placement and has been updated to address lead-free assembly technology. 25 pages. Released February 2012.
SDO IPC: IPC by Global Electronics Association
Document Number IPC-9704
Publication Date Feb. 3, 2012
Language en - English
Page Count 32
Revision Level A
Supercedes
Committee
Loading...

Failed to load document history.

Publish Date Document Id Type View