ISO 4825-1:2023

Current Revision
Fine ceramics (advanced ceramics, advanced technical ceramics) --Test method for thermal property measurements of metalized ceramic substrates - Part 1: Evaluation of thermal resistance for use in power modules

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ISO 4825-1:2023

Fine ceramics (advanced ceramics, advanced technical ceramics) --Test method for thermal property measurements of metalized ceramic substrates - Part 1: Evaluation of thermal resistance for use in power modules

PUBLISH DATE 2023
ISO 4825-1:2023

This document specifies a method for measuring the thermal resistance between a heater chip and a cold plate with the heater chip mounted on a metalized ceramic substrate, imitating a silicon carbide (SiC) high-output power module.

This measurement represents an index of the heat dissipation characteristics of a metallized ceramic substrate used in a high-output power module.

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