ISO 9453:2020

Current Revision
Soft solder alloys - Chemical compositions and forms

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ISO 9453:2020

Soft solder alloys - Chemical compositions and forms

PUBLISH DATE 2020
ISO 9453:2020

This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.

An indication of the forms generally available is also included.

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