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JEDEC JESD22-B106E

RESISTANCE TO SOLDER SHOCK FOR THROUGH-HOLE MOUNTED DEVICES
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JEDEC JESD22-B106E

RESISTANCE TO SOLDER SHOCK FOR THROUGH-HOLE MOUNTED DEVICES

PUBLISH DATE 2023
JEDEC JESD22-B106E
This test method is used to determine whether solid state devices can withstand the effect of the temperature shock to which they will be subjected during soldering of their leads in a solderwave process and/or solder fountain (rework/replacement) process. The heat is conducted through the leads into the device package from solder heat at the reverse side of the board.
SDO JEDEC: LEGACY IMPORT
Document Number
Publication Date Feb. 1, 2023
Language en - English
Page Count
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Supercedes
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