JEDEC JESD22-B106E

Current Revision
RESISTANCE TO SOLDER SHOCK FOR THROUGH-HOLE MOUNTED DEVICES

Best Price Guarantee Feb 1, 2023 English 1 Pages

Sub Total (1 Item(s)) $ 0.00
Estimated Shipping $ 0.00
Total (Pre-Tax) $ 0.00
View in Library
or
Joint Electron Device Engineering Council Solid State Technology Association Logo

RESISTANCE TO SOLDER SHOCK FOR THROUGH-HOLE MOUNTED DEVICES

PUBLISH DATE 2023
This test method is used to determine whether solid state devices can withstand the effect of the temperature shock to which they will be subjected during soldering of their leads in a solderwave process and/or solder fountain (rework/replacement) process. The heat is conducted through the leads into the device package from solder heat at the reverse side of the board.
Loading...

Failed to load document history.

Publish Date Document Id Type View