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JEDEC JESD22-B112C

Package Warpage Measurement of Surface-Mount Integrated Circuits at Elevated Temperature
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JEDEC JESD22-B112C

Package Warpage Measurement of Surface-Mount Integrated Circuits at Elevated Temperature

PUBLISH DATE 2023
JEDEC JESD22-B112C
This test method is to measure the deviation from uniform flatness of an integrated circuit package body for the range of thermal conditions experienced during the surface-mount soldering operation.
SDO JEDEC: LEGACY IMPORT
Document Number
Publication Date Nov. 1, 2023
Language en - English
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Supercedes
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