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JEDEC JESD22-B113C

Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of SMT ICs for Handheld Electronic Products
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JEDEC JESD22-B113C

Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of SMT ICs for Handheld Electronic Products

PUBLISH DATE 2025
JEDEC JESD22-B113C
This test method is intended to evaluate and compare the performance of SMT ICs in an accelerated test environment for handheld electronic products applications.
SDO JEDEC: LEGACY IMPORT
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Publication Date Nov. 1, 2025
Language en - English
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