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JEDEC JESD22-B116B

WIRE BOND SHEAR TEST
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JEDEC JESD22-B116B

WIRE BOND SHEAR TEST

PUBLISH DATE 2017
JEDEC JESD22-B116B
This fully revised test provides a means for determining the strength of gold and copper ball bonds to a die or package bonding surface, and may be performed on pre-encapsulation or post-encapsulation parts. Pictures have been added to enhance the fail mode diagrams. The wire bond shear test is destructive. The test method can also be used to shear aluminum and copper wedge bonds to a die or package bonding surface. It is appropriate for use in process development, process control and/or quality assurance.
SDO JEDEC: LEGACY IMPORT
Document Number
Publication Date May 1, 2017
Language en - English
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