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JEDEC JESD22-B118A

SEMICONDUCTOR WAFER AND DIE BACKSIDE EXTERNAL VISUAL INSPECTION
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JEDEC JESD22-B118A

SEMICONDUCTOR WAFER AND DIE BACKSIDE EXTERNAL VISUAL INSPECTION

PUBLISH DATE 2021
JEDEC JESD22-B118A
This inspection method is for product semiconductor wafers and dice prior to assembly. This test method defines the requirements to execute a standardized external visual inspection and is a non-invasive and nondestructive examination that can be used for qualification, quality monitoring, and lot acceptance.
SDO JEDEC: LEGACY IMPORT
Document Number
Publication Date Nov. 1, 2021
Language en - English
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Supercedes
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