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JEDEC JESD22-B120.01

Wire Bond Pull Test Methods
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JEDEC JESD22-B120.01

Wire Bond Pull Test Methods

PUBLISH DATE 2024
JEDEC JESD22-B120.01
This test method provides a means for determining the strength and failure mode of a wire bonded to, and the corresponding interconnects on, a die or package bonding surface and may be performed on pre-encapsulation or post-encapsulation devices.
SDO JEDEC: LEGACY IMPORT
Document Number
Publication Date Sept. 1, 2024
Language en - English
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Supercedes
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