Test methods of variable capacitors for use in electronic equipment

Test methods of copper-clad laminates for flexible printed wiring boards

Copper-clad laminates for flexible printed wiring boards (Polyester film, Polyimide film)

General rules of copper-clad laminates for printed wiring boards

Test methods of copper-clad laminates for printed wiring boards

Copper-clad laminates for printed wiring boards -- Paper base, epoxy resin

Copper-clad laminates for printed wiring boards -- Synthetic fiber fabric base, epoxy resin

Base materials for printed circuits -- Epoxide woven E-glass laminated sheets of defined flammability (vertical burning test)

Base materials for printed circuits -- Paper base, phenolic resin

Base materials for printed circuits -- Epoxide cellulose paper core, epoxide glass cloth surfaces copper-clad laminated sheet of defined flammability (vertical burning test)

Base materials for printed circuits -- Epoxide non-woven/woven glass reinforced copper-clad laminated sheet of defined flammability (vertical burning test)

Base materials for printed circuits -- Polyimide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)

Base materials for printed circuits -- Bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)

Base materials for printed circuits -- Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed board

Base materials for printed circuits -- Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

Copper foil for printed wiring boards

General rules of prepreg for multilayer printed wiring boards

Test methods of prepreg for multilayer printed wiring boards

Prepreg for multilayer printed wiring boards -- Epoxy resin-impregnated glass cloth

Prepreg for multilayer printed wiring boards -- Modified or unmodified polyimide resin-impregnated glass cloth

Prepreg for multilayer printed wiring boards -- Bismaleimide/Triazine/Epoxide resin-Impregnated glass Cloth

Miniature fuses -- Part 1: Definitions of miniature fuses and general requirements for miniature fuse-links

Miniature fuses -- Part 4: Universal modular fuse-links (UMF), and non-UM through-hole and surface mount fuse-links

Thermal-links -- Requirements and application guide

Generic specification and test methods of quartz crystal units