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Compound, Corrosion-Preventive Hard Film, Hot Application
Compound, Corrosion, Preventive, Hard Film, Cold Application
Compound, Corrosion Preventive Soft Film, Thixotropic, Cold Application
Compound, Corrosion Preventive, Soft Film, Cold Application
Compound, Corrosion-Preventive, Soft Film, Hot Application
Compound-Anti-Seize, White Lead Base
Anti-Scuffing Treatment, Graphite Varnish
Compound-Anti-Seize, (Mica Base)
Lubricant, Solid Film Minimal Outgassing
Fluid, Reference for Testing AS5780 HPC Class (Polyol) Resistant Material (Also known as Eastman Reference Oil 300)
COMPOUND, INSULATING AND SEALING, SILICONE
Lubricant, Dry Film, Heat Cured, For Fasteners Polysulfide Sealant Compatible
Mold Release Agent
Release Agent, for Use During Form-in-Place Gasket Preparation
Curing Agent, Solid Aromatic Amine, 4, 4-Diaminodiphenyl Sulfone
Adhesion Promoter for Polysulfide Sealing Compounds Nonhalogenated Solvent
Adhesion Promoter for Polysulfide Sealing Compounds Nonrestricted Solvent
Adhesion Promoter for Polysulfide Sealing Compounds Water Based
Sealing Compound, Polythioether Rubber Fast Curing, Light Weight (Specific Gravity 0.78, Max) for Integral Fuel Tanks and General Purpose, Intermittent Use to 360 °F (182 °C)
Primer, Adhesive, Corrosion-Inhibiting -55 to +95°C (-67 to +203°F)
Primer, Adhesive, Corrosion-Inhibiting High Durability Epoxy, -55 to +95 °C (-67 to +203 °F)
Primer, Adhesive, Corrosion-Inhibiting High Durability Epoxy, -55 to +175 °C (-67 to +347 °F)
Primer, Adhesive, Corrosion-Inhibiting High Durability Epoxy, -55 to +215 °C (-67 to +419 °F)
Primer, Ocher Phenolic
Primer, Adhesive, Electrodeposited -55 to +82 °C (-67 to +180 °F)