A collection of featured documents from our library that are popular among our users or otherwise noteworthy.
Tubing, Irradiated Modified Fluoropolymer Plastic, Electrical Insulation Flame Resistant, Flexible, Heat-Shrinkable, 2 to 1 Shrink Ratio
Resin, Polyimide, Sealing High-Temperature Resistant, 315 °C (600 °F) Unfilled
Adhesive, Synthetic Rubber, Buna N Type
Adhesive, Polyimide Resin, Film and Paste High Temperature Resistant, 315 °C (599 °F)
Adhesive, Foaming, Honeycomb Core Splice, Structural −55 to +82 °C (−65 to +180 °F)
Adhesive, Foaming, Honeycomb, Core Splice, Structural −54 to +177 °C (−65 to +350 °F)
Adhesive Compound, Epoxy Room Temperature Curing
Adhesive Compound, Epoxy Medium Temperature Application
Adhesive Compound, Epoxy Resin High Temperature Application
Adhesive, Modified Epoxy Moderate Heat Resistant, 120 °C (250 °F) Curing, Film Type
Aerodynamic Smoothing Compound, Flexible −55° to +130°C (−65° to +270°F)
Adhesive Film, Epoxy-Base for High Durability Structural Adhesive Bonding
Adhesive Film, Epoxy-Base, High Durability For 95 °C (200 °F) Service
Adhesive Film, Epoxy-Base, High Durability For 120 °C (250 °F) Service
Adhesive Film, Epoxy-Base, High Durability For 175 °C (350 °F) Service
Adhesive Film, Epoxy-Base, High Durability For 215 °C (420 °F) Service
Aerodynamic Fairing Compound −55° to +85°C (−65° to +185°F)
Aerodynamic Fairing Compound −55° to +150°C (−65° to +300°F)
Adhesive Film, Hot-Melt, Addition-Type Polyimide For Foam Sandwich Structure, −55 to +230 °C (−65 to +450 °F)
Resin System, Epoxy, Carbon Microballoon Filled, 135 °C (275 °F) Cure
Epoxy Resin, Tetraglycidyl Methylenedianiline (TGMDA), 10,000 to 14,000 Centipoise Viscosity
Epoxy Resin, Tetraglycidyl Methylenedianiline, 14,000 to 18,000 Centipoise Viscosity
Adhesive, Electrically Nonconductive, Moderately Rapid Cure
Adhesive, Contact Polychloroprene (CR) Rubber, Resin Modified
Epoxy Resin, Cycloaliphatic Liquid