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BSI BS EN 60317-35:2014+A1:2019

Specifications for particular types of winding wires -- Solderable polyurethane enamelled round copper wire, class 155, with a bonding layer
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BSI BS EN 60317-35:2014+A1:2019

Specifications for particular types of winding wires -- Solderable polyurethane enamelled round copper wire, class 155, with a bonding layer

PUBLISH DATE 2019
PAGES 18
BSI BS EN 60317-35:2014+A1:2019

This part of IEC 60317 specifies the requirements of solderable enamelled round copper winding wire of class 155 with a dual coating. The underlying coating is based on polyurethane resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements. The superimposed coating is a bonding layer based on a thermoplastic resin.

NOTE A modified resin is a resin that has undergone a chemical change, or contains one or more additives to enhance certain performance or application characteristics.

The range of nominal conductor diameters covered by this standard is:

  • Grade 1B: 0,020 mm up to and including 0,800 mm;

  • Grade 2B: 0,020 mm up to and including 0,800 mm.

The nominal conductor diameters are specified in Clause 4 of IEC 60317‑0‑1:2013.

SDO BSI: British Standards Institution
Document Number EN 60317-35
Publication Date Oct. 28, 2019
Language en - English
Page Count
Revision Level 1
Supercedes
Committee W/-
Publish Date Document Id Type View
Feb. 28, 2014 BS EN 60317-35:2014 Revision
April 15, 2001 BS EN 60317-35:1995 Revision
Aug. 8, 2024 BS EN 60317-35:2014+A2:2024 Consolidated
Oct. 28, 2019 BS EN 60317-35:2014+A1:2019 Consolidated