+1 888 608-7511
Need help finding a standard?
Help Desk
This Document Has Been Superseded
A newer publication replaces it: BSI BS EN IEC 60749-37
Semiconductor devices. Mechanical and climatic test methods -- Board level drop test method using an accelerometer
Provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure.
The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test.
Failed to load document history.
| Publish Date | Document Id | Type | View |
|---|