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Semiconductor devices. Mechanical and climatic test methods -- Board level drop test method using an accelerometer
IEC 60749-37:2022 RLV contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 60749-37:2022 provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure.
The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test.
This edition includes the following significant technical changes with respect to the previous edition:
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