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BSI BS EN 61191-3:2017

Printed board assemblies -- Sectional specification. Requirements for through-hole mount soldered assemblies
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BSI BS EN 61191-3:2017

Printed board assemblies -- Sectional specification. Requirements for through-hole mount soldered assemblies

PUBLISH DATE 2017
PAGES 26
BSI BS EN 61191-3:2017

This part of IEC 61191 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).

SDO BSI: British Standards Institution
Document Number EN 61191-3
Publication Date Sept. 25, 2017
Language en - English
Page Count 26
Revision Level
Supercedes
Committee EPL/501
Publish Date Document Id Type View
Sept. 25, 2017 BS EN 61191-3:2017 Revision
Jan. 15, 1999 BS EN 61191-3:1999 Revision