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IEC 61191-3 Ed. 2.0 en:2017

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
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IEC 61191-3 Ed. 2.0 en:2017

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

PUBLISH DATE 2017
PAGES 24
IEC 61191-3 Ed. 2.0 en:2017

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

IEC 61191-3:2017(E) prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e., surface mount, chip mounting, terminal mounting).

This edition includes the following significant technical changes with respect to the previous edition:

  • a) The requirements have been updated to be compliant with the acceptance criteria in IPC-A-610F.
SDO IEC: International Electrotechnical Commission
Document Number IEC 61191
Publication Date May 1, 2017
Language en - English
Page Count
Revision Level 2.0
Supercedes
Committee 91
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