Logo
Login Sign Up
Current Revision

IEC 61191-3 Ed. 2.0 b:2017

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
Best Price Guarantee

$189.00

2-5 Days

$189.00

SAVE 10%

$340.20


Sub Total (1 Item(s))

$ 0.00

Estimated Shipping

$ 0.00

Total (Pre-Tax)

$ 0.00


or
International Electrotechnical Commission Logo

IEC 61191-3 Ed. 2.0 b:2017

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

PUBLISH DATE 2026
IEC 61191-3 Ed. 2.0 b:2017
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
IEC 61191-3:2017 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e.. surface mount, chip mounting, terminal mounting).
This edition includes the following significant technical changes with respect to the previous edition:
a) The requirements have been updated to be compliant wit the acceptance criteria in IPC-A-610F.
SDO IEC: International Electrotechnical Commission
Document Number IEC 61191
Publication Date April 1, 2026
Language b - English & French
Page Count
Revision Level 2.0
Supercedes
Committee 91
Publish Date Document Id Type View
April 1, 2026 IEC 61191-3 Ed. 2.0 en:2017 Revision
May 1, 2017 Revision
April 1, 2026 IEC 61191-3 Ed. 2.0 b:2017 Revision
June 5, 2024 Revision