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BSI BS EN IEC 61188-6-1:2021

Circuit boards and circuit board assemblies. Design and use -- Land pattern design. Generic requirements for land pattern on circuit boards
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BSI BS EN IEC 61188-6-1:2021

Circuit boards and circuit board assemblies. Design and use -- Land pattern design. Generic requirements for land pattern on circuit boards

PUBLISH DATE 2021
PAGES 36
BSI BS EN IEC 61188-6-1:2021
IEC 61188-6-1:2021 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through-hole mounted components. These requirements are based on the solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.
SDO BSI: British Standards Institution
Document Number IEC 61188-6-1
Publication Date April 7, 2021
Language en - English
Page Count 36
Revision Level
Supercedes
Committee EPL/501
Publish Date Document Id Type View
April 7, 2021 BS EN IEC 61188-6-1:2021 Revision