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BSI BS EN IEC 61188-6-2:2021

Circuit boards and circuit board assemblies. Design and use -- Land pattern design. Description of land pattern for the most common surface mounted components (SMD)
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BSI BS EN IEC 61188-6-2:2021

Circuit boards and circuit board assemblies. Design and use -- Land pattern design. Description of land pattern for the most common surface mounted components (SMD)

PUBLISH DATE 2021
PAGES 32
BSI BS EN IEC 61188-6-2:2021
IEC 61188-6-2:2021 describes the requirements of design and use for soldering surfaces of land pattern on circuit boards. This document includes land pattern for surface mounted components. These requirements are based on the solder joint requirements of IEC 61191‑2:2017.
SDO BSI: British Standards Institution
Document Number IEC 61188-6-2
Publication Date March 19, 2021
Language en - English
Page Count 32
Revision Level
Supercedes
Committee EPL/501
Publish Date Document Id Type View
March 19, 2021 BS EN IEC 61188-6-2:2021 Revision