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BSI BS EN IEC 61188-6-3:2025

Circuit boards and circuit board assemblies. Design and use -- Land pattern design. Description of land pattern for through hole components (THT)
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BSI BS EN IEC 61188-6-3:2025

Circuit boards and circuit board assemblies. Design and use -- Land pattern design. Description of land pattern for through hole components (THT)

PUBLISH DATE 2025
PAGES 36
BSI BS EN IEC 61188-6-3:2025
IEC 61188-6-3:2024 specifies the requirements for lands and land pattern on circuit boards for the mounting of components with leads by soldering based on the solder joint requirements of IEC 61191-1 and IEC 61191-3. This part of IEC 61188 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through hole mounted components. These requirements are based on the solder joint requirements of IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4. This first edition partially cancels and replaces the IEC 61188-5 series of International Standards. The significant technical changes with respect to the previous edition are listed in the Introduction and further detailed information and calculations can be found in Annex A.
SDO BSI: British Standards Institution
Document Number IEC 61188-6-3
Publication Date Feb. 4, 2025
Language en - English
Page Count 36
Revision Level
Supercedes
Committee EPL/501
Publish Date Document Id Type View
Feb. 4, 2025 BS EN IEC 61188-6-3:2025 Revision