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BSI BS EN IEC 62878-2-5:2019

Device embedding assembly technology -- Guidelines. Implementation of a 3D data format for device embedded substrate
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BSI BS EN IEC 62878-2-5:2019

Device embedding assembly technology -- Guidelines. Implementation of a 3D data format for device embedded substrate

PUBLISH DATE 2019
PAGES 58
BSI BS EN IEC 62878-2-5:2019

This part of IEC 62878 specifies requirements based on XML schema that represents a design data format for device embedded substrate, which is a board comprising embedded active and passive devices whose electrical connections are made by means of a via, electroplating, conductive paste or printing of conductive material.

This data format is to be used for simulation (e.g. stress, thermal, EMC), tooling, manufacturing, assembly, and inspection requirements. Furthermore, the data format is used for transferring information among printed board designers, printed board simulation engineer, manufacturers, and assemblers.

This part of IEC 62878 applies to substrates using organic material. It neither applies to the re-distribution layer (RDL) nor to the electronic modules defined as M-type business model in IEC 62421.

SDO BSI: British Standards Institution
Document Number IEC 62878-2-5
Publication Date Nov. 18, 2019
Language en - English
Page Count 58
Revision Level
Supercedes
Committee EPL/501
Publish Date Document Id Type View
Nov. 18, 2019 BS EN IEC 62878-2-5:2019 Revision