Logo
Login Sign Up
Current Revision

BSI PD IEC TR 61191-8:2021

Printed board assemblies -- Voiding in solder joints of printed board assemblies for use in automotive electronic control units. Best practices
Best Price Guarantee
Instant

$364.34

2-5 Days

$364.34

SAVE 10%

$655.81


Sub Total (1 Item(s))

$ 0.00

Estimated Shipping

$ 0.00

Total (Pre-Tax)

$ 0.00


or
British Standards Institution Logo

BSI PD IEC TR 61191-8:2021

Printed board assemblies -- Voiding in solder joints of printed board assemblies for use in automotive electronic control units. Best practices

PUBLISH DATE 2021
PAGES 38
BSI PD IEC TR 61191-8:2021

This part of IEC 61191 gives guidelines for dealing with voiding in surface-mount solder joints of printed board assemblies for use in automotive electronics. This technical report focuses exclusively on voids in solder joints connecting packaged electronic or electromechanical components with printed boards (PBs). Voids in other solder joints (e.g. in a joint between a silicon die and a substrate within an electronic component, solder joints of through-hole components, etc.) are not considered. The technical background for the occurrence of voids in solder joints, the potential impact of voiding on printed board assembly reliability and functionality, the investigation of voiding levels in sample- and series-production by use of X-ray inspection as well as typical voiding levels in different types of solder joints are discussed. Recommendations for the control of voiding in series production are also given.

Annex A collects typical voiding levels of components and recommendations for acceptability.

SDO BSI: British Standards Institution
Document Number IEC TR 61191-8
Publication Date March 25, 2021
Language en - English
Page Count 38
Revision Level
Supercedes
Committee EPL/501
Publish Date Document Id Type View
March 25, 2021 PD IEC TR 61191-8:2021 Revision