IEC 60115-4 Ed. 3.0 b:2022

Current Revision
Fixed resistors for use in electronic equipment - Part 4: Sectional specification: Power resistors for through hole assembly on circuit boards (THT) or for assembly on chassis

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Fixed resistors for use in electronic equipment - Part 4: Sectional specification: Power resistors for through hole assembly on circuit boards (THT) or for assembly on chassis

IEC 60115-4:2022 relates to resistors having a rated dissipation typically greater than 1 W up to and including 1 000 W for use in electronic equipment. This document is applicable to fixed power resistors with a maximum surface temperature (MET) higher than the preferred upper category temperature (UCT) of 200 °C.

NOTE: Heat sink resistors, i.e. resistors which in their operation depend on being mounted on a dedicated heat sink, owing to their special temperature conditions, are covered by a special sectional specification (under consideration at the time of publication).

These resistors are typically described according to:

  • types (different geometric shapes)
  • styles (different dimensions)
  • product technology.

The object of this document is to define preferred ratings and characteristics and to select from IEC 60115-1 the appropriate quality assessment procedures, tests and measuring methods and to give general performance requirements for this type of resistor.

NOTE: SMD resistors are covered by IEC 60115-8, regardless of their dissipation.

This edition includes the following significant technical changes with respect to the previous edition:

  • The definitions of product technologies and product classification levels of the generic specification, IEC 60115-1:2020, have been adopted;
  • A basis for the optional specification of the lead eccentricity of axial leaded resistors has been amended in 4.2;
  • The 'period-pulse high-voltage overload test' of IEC 60115-1:2020, 8.3 has been adopted as default test method in 5.3.9, thereby replacing the legacy test 'periodic-pulse overload test of IEC 60115-1:2020, 8.4;
  • The revised solderability test of IEC 60115-1:2020, 11.1 has been adopted in 5.3.22 and 5.3.23;
  • The combined solvent resistance test of IEC 60115-1:2020, 11.3 has been adopted in 5.3.25;
  • The 'endurance at room temperature test' of IEC 60115-1:2020, 7.2 has been reworked and adopted in 5.3.5;
  • The 'single-pulse high-voltage overload test' of IEC 60115-1:2020, 8.2, applied with the pulse shape 10/700 in 5.3.8, is complemented with the optional alternative provided by the pulse shape 1,2/50 in 5.4.1;
  • Climatic tests for 'operation at low temperature' of IEC 60115 1:2020, 10.2, and for 'damp heat, steady state, accelerated' of IEC 60115 1:2020, 10.5, have been adopted as optional tests in 5.4.5. and 5.4.6, respectively;
  • Inclusion of an optional flammability test as 5.4.8;
  • New guidance is provided in 6.2 on the presentation of stability requirements with their permissible absolute and relative deviations;
  • Acceptance criteria for the visual inspection have been added in 6.5 and in Annex B;
  • Visual inspection for the primary and proximity packaging has been added in 6.5.3 and in 7.2;
  • The periodical evaluation of termination platings has been added as a new topic of quality assessment in 9.8;
  • The revised test clause numbering of IEC 60115-1:2020 has been applied;
  • A new Annex C has been added to summarize workmanship requirements for the assembly of leaded power resistors, e.g. as given in the prior IEC 61192 series of standards;
  • The informative Annex F on radial formed styles has been amended with details on a formed Z-bend style for surface-mount assembly;
  • Furthermore, the informative Annex X has been ad
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