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IEC 60191-6-18 Ed. 1.0 b:2010

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
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IEC 60191-6-18 Ed. 1.0 b:2010

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

PUBLISH DATE 2010
PAGES 44
IEC 60191-6-18 Ed. 1.0 b:2010

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages.

Design guide for ball grid array (BGA).

IEC 60191-6-18:2010 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA).

The standard applies to BGAs whose terminal pitch is 1 mm or larger.

SDO IEC: International Electrotechnical Commission
Document Number IEC 60191
Publication Date Jan. 1, 2010
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 47D
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