IEC 60191-6-18 Ed. 1.0 b Cor.1:2010

Current Corrigendum
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

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Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

PUBLISH DATE 2010
PAGES 1

Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 6-18:

General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

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